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		Effect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump by Xiao, Guo-Wei Chan, Philip C. H Cai, Jian Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Physical Thermal Noise Model for Soi Mosfet by Jin, Wei Chan, Philip C. H Lau, Jack Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fuliy Depleted Cmos/Soi Device Design Guidelines for Low-Power Applications by Banna, Srinivasa R Chan, Philip C. H Chan, Mansun Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Unified Understanding on Fuliy-Depleted Soi Nmosfet Hot-Carrier Degradation by Banna, Srinivasa R Chan, Philip C. H Fung, Samuel K. H Source: IEEE Transactions on Electron Devices Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mobility Management Incorporation Fuzzy Logic Foe A Heterogeneous Enviornment by Chan, Philip C. H Sheriff, H. S Source: Ieee Transactions on Communications Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Adiabatic Differential Logic for Low-Power Digital Systems. by Chan, Philip C. H Lo, Chun-Keung Source: Ieee Transactions on Circuits and Systems-Ii: Express Briefs ( for merly: Analog & Digital Signal Processing) Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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