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		Transient Thermal Analysis of an Acf Package Assembly Process by Chiriac, Victor Adrian Lee, Tien-Yu Tom Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mechanicbased Solution to Rf Mems Switch Stictch Stiction Problem by Mercado, P. E Lee, Tien-Yu Tom Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Application of Cfd Technology to Electronic Thermal Management by Lee, Tien-Yu Tom Mahalingam, Mali Chambers, B Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Evaluation of a Powerpc 620 Microprocessor in a Multiprocessor Computer by Wong, Henry Lee, Tien-Yu Tom Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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