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Investigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading by
  • Fan, X-J
  • lim, T. B
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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A Three-Dimensional Modeling of Wire Sweep Incorporating Resin Cure by
  • Wu, J H
  • Tay, A. A. O
  • lim, T.B
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Compact Ultra-Wideband Bandpass Filter Using Harmonic-Suppressed Multiple-Mode Resonator by
  • Lim, T.B
Source: IET:IEE: Electronics Letters
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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