Mapping of Mechanical, Thermomechanical and Wire-Bond Strain Fields in Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray Topography

By: Material type: ArticleArticleDescription: 76-83 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
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Articles Articles Periodical Section Vol.24, No.01 (Mar. 2001) Available