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		Modeling Contact Between Rigid Sphere Bonded to Rigid Substrate by Stevanovic, Mirko Yovanovich, M. Michael Culham, J. Richard Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization by Culham, J. Richard Muzychka, Y. S Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Thermal Modeling of Lsothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection by Culham, J. Richard Yovanovich, M. Michael Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Analytical Modeling of Spreading Resistance in Flux Tubes, Half Spaces, and Compound Disks by Yovanovich, M. Michael Culham, J. Richard Teertstra, Pete Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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