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Transient Thermal Characterization OfPolymer Stud Grid Array by
  • Driessens, Evelien
  • Beyne, Eric
  • Vandevelde, Bart
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Solder Parameter Sensitivity for Csp Life-Time Prediction Using Simulation-Based Optimization Method by
  • Vandevelde, Bart
Source: Ieee Transactions onElectronics Packaging Manufacturing
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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