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		Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries by Saitoh, Takehisa Toya, M Matsuyama, Y Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Multiple Descent Cost Competition: Restorable Self-Organization and Multmedia Information Processing. by Matsuyama, Y Source: Ieee Transactions on Neural Networks Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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