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Elcectrical Design of an Mcm Package for a Multi-Processor Dirgital System by
  • SARfaraz, Ali
  • Swaminathan, Madhavan
  • Bhatia, H
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Structural Behavior of Repaired Pier Walls. by
  • Bhatia, H
  • Pardoen, G
  • Haroun, M
Source: Aci Structural Journal
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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