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Mems Packaging by
  • Hsu, Tai-Ran [editor]
Series: Emis Processing Series ; No. 3
Material type: Text Text
Language: English
Publication details: London : Inspec/The Institution of Electrical Engineers, c2004
Online access:
Availability: Items available for loan: Circulation Section (2)Location, call number: Circulation Section 621.381 HSU, ...
Cover image
Process Technology for Silicon Carbide Devices by
  • Zetterling, Carl Mikael [editor]
  • Institution of Electrical Engineers
Series: Emis Processing Series ; No. 2
Material type: Text Text
Language: English
Publication details: London : Inspec, c2002
Online access:
Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.38152 ZET.
Cover image
Silicon Wafer Bonding Technology for VLSI and Mems Applications by
  • Iyer, Subramanian S [editor]
  • Auberton-Herve, Andre J [editor]
Series: Emis Processing Series ; No. 1
Material type: Text Text
Language: English
Publication details: London : Inspec, c2002
Online access:
Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.38152 IYE.
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