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		Wafer Scale Photonic-Die Attachment by Boudreau, Robert Bowen, Terry Zhou, Ping Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fault Detection in Cmos/Soi Mixed-Signal UsingQuiescent Current Test by Venuto, D. De Kayal, M Ohletz, M.J Source: Microelectronics Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Fine Grinding of Silicon Wafers: Designed Experiments by Pei, Z J Strasbaugh, Alan Source: International Journal of Machine tools & Manufacture: Design, Research and Application Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		DirectElectronics Levitation and Propulsion. by Jin, J Higuchi, T Source: IEEE Transactions on Industrial Electronics Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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