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Effective Material Properties and Themal Stress Analysis of Epoxy Molding Compound in Electronic Packaging by
  • Shin, Dong-Kwang
  • Lee, Jung-Ju
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Validation of A Novel Dielectric Constant Simulation Model andDetermination of Its Physical Parameters by
  • todd, Micheal G
  • Shi, Frank G
Source: Microelectronics Journal
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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