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		Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints by Vries, J. Hans De Janssen, Esther Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electricaliy Conductive Adhesives: a Prospective Alternative for Smd Soldering by Jagt, J. C lijten, G. F. C. M Beris, P. J. M Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Conductive Adhesives for Smt and Potential Applications by Hvims, Henrik L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Reliability Issues of Replacing Solder with Conductive Adhesives in Power Modules by Rusanen, Outi Lenkkeri, Jaako Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Use of Surface Insulation Resistance and Contact Angle Measurements to CharacterizeInteractions of Three Water Soluble Fluxes with Fr-4 Substrates by Jachim, Jenny A Freeman, Garth B Turbini, Laura J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Accelerated life Test of Z-Axis Conductive Adhesives by Chang, D. D Fulton, J. A Wong, C. P Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electrical, Structural and Processing Properties of Electricaliy Conductive Adhesives by Christine, li li Kim, Gabsoo Morris, James E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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