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Integrated Flex Rigid-Flex Capability in a High Performance Mcm by
  • light, David N
  • Davis, Charles R
  • Kresge, John S
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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The Single Chip Versus Multichip Packaging Option for Digital Cmos In1990'S by
  • Fililon, Raymond A
  • Neugebauer, Constantine A
  • Daum, Wolfgang
Source: IEEE Transactions on Components Hybrids and Manufacturing Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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