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		Fdtd Modeling of Noise in Computer Packages by Becker, Wiren D Mittrapiyanuruk, Pradit Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling, Measurement, and Simulation of Simultaneous Switching Noise by Mccredie, Bradley D Becker, Wiren D Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling, Simulation, and Measurement of Mid-Frequency Simultaneous Switching Noise in Computer Systems by Becker, Wiren D Eckhardt, Jim Smith, Howard H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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