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Molecular Basis OfInterphase Dielectric Properties of Microelectronic and Optoelectronic Packaging Materials by
  • Todd, Micheal G
  • Shi, Frank G
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Validation of A Novel Dielectric Constant Simulation Model andDetermination of Its Physical Parameters by
  • todd, Micheal G
  • Shi, Frank G
Source: Microelectronics Journal
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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