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		A Device life Cycle Analysis OfWsi Associative String Processor by Lea, R. Mike Bolouri, H Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cost-Effective Multichip Module Manufacture Using Passive Substrate Fault Tolerance by Peacock, Christopher Bolouri, H Habiger, C. M Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Identification of Complex Shapes Using Oa Self Organizing Neural System. by Bolouri, H Ferguson, A Sabisch, T Source: Ieee Transactions on Neural Networks Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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