Your search returned 4 results.

Results
		To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures by Pecht, Michael Paik, Hye-Young Bhandarkar, S. Navin Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Assessing Time-To Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates by Rudra, Balu Pecht, Michael Jennings, David Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Model for Moisture Induced Corrosion Failures in Microelectronic Packages by Pecht, Michael Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Evaluation of Selected Japanese Lead-Free ConsumerElectronics by Fukuda, Yuki Pecht, Michael Casey, Paul Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search