Yang, Wei-Bin <br/><br/>
ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier 

 - 1947-1954 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Cobalt Oxides<br/>Copper Conductor<br/>Diffusion Barriers