Chang, Shyang-Jye Hwang, Sheng-Jye <br/><br/>
Design and Fabrication of An Ic Encapsulation Mold Adhesion  Force Tester 

 - 281-285 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Adhesion  Force<br/>Emc<br/>Ic Packaging