Noguchi, Junji Oshima, Takayuki <br/><br/>
Integration and Reliability of Cu-Sioc Interconnect  for  Arf/90-Nm Node Cmos Technology 

 - 2168-2174 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Copper<br/>Dielectric Breakdown<br/>Electromigration