Tatsuyuki, Saito Ashihara, Hiroshi <br/><br/>
A Reliability of Barrier-Metal-Clad Copper Interconnects with Self-Aligned Metallic Caps 

 - 2129-2135 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Chemical Vapor Deposition (Cvd)<br/>Copper Losses<br/>Electromigration