Hayashi, Tsuyoshi <br/><br/>
An Innovative Bonding Technique  for  Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments 

 - 225-230 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Optoelectronic<br/>Innovative Design<br/>Solder Bump Radius