Mashiko, Youji Kohara, Masanobu <br/><br/>
Mechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide 

 - 873-878 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Mechanism<br/>Electromigration<br/>Ceramic Packages