Suryanarayana, Darbha Wu, Tien H. Varcoe, Jack A. <br/><br/>
Encapsulants Used in Flip-Chip Packages 

 - 858-862 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Encapsulant<br/>Flip-Chip<br/>Packaging