Amazawa, Takao Arita, Yoshinobu Yamamoto, EIIchi <br/><br/>
Planarized Multilevel Interconnection Using Chemical Mechanical Polishing of Selective Cvd-Ai Via Plugs 

 - 815-820 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Aluminum Integrated Circuit Conductors<br/>Electromigration<br/>Cmp