TY  - SER
AU  - Saitoh, Takehisa
AU  - Toya, M
AU  - Matsuyama, Y
TI  - Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries
KW  - Die Bond
KW  - Encapsulant
KW  - Temperature
ER  -