Saitoh, Takehisa Toya, M Matsuyama, Y <br/><br/>
Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries 

 - 407-412 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Die Bond<br/>Encapsulant<br/>Temperature