TY  - SER
AU  - Cho, Soon-Jin
AU  - Paik, Kyung-Wook
AU  - Kim, Yong-Ju
TI  - The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound
KW  - Adhesion
KW  - Copper Oxide
KW  - Leadframes
ER  -