Cho, Soon-Jin Paik, Kyung-Wook Kim, Yong-Ju <br/><br/>
The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound 

 - 167-175 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Adhesion<br/>Copper Oxide<br/>Leadframes