Smyth, T. Tan, liang Chan, K. <br/><br/>
A Simulation Study of Long Throw Sputtering  for  Diffusion Barrier Deposition Into High Aspect Vias and Contacts 

 - 1414-1425 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated Circuit Metalilzation<br/>Semiconductor Process Modeling<br/>Simulation