TY  - SER
AU  - So, H. W.
AU  - Taube, A.
TI  - Numerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint
KW  - Numerical Investigation
KW  - Material Parameters
KW  - Adhesive Lyer Profile Effect
ER  -