Pecht, Michael Paik, Hye-Young Bhandarkar, S. Navin <br/><br/>
To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures 

 - 150-153 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Creep Test<br/>Thermomecanique<br/>Multilayer