Kubacki, Ronald M. <br/><br/>
Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies 

 - 471-477 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Temperature Plasma<br/>High Performance