Jang, Kyung-Woon Kwon, Woon-Seong <br/><br/>
Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps)  for  Flip-Chip Applications 

 - 608-615 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Diluent<br/>Filier Size<br/>Thermal Cycle Stability