Vries, J. Hans De Janssen, Esther <br/><br/>
Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with  Conductive Adhesive Joints 

 - 563-568 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Conductive Adhesive<br/>Flip Chi P<br/>Flexible Structure