TY  - SER
AU  - Amagai, Masazumi
AU  - Ebe, Kazuyoshi
AU  - Seno, Hideo
TI  - Cracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination
KW  - Wafer
KW  - Adhesive
KW  - Package Modeling
ER  -