Amagai, Masazumi Ebe, Kazuyoshi Seno, Hideo <br/><br/>
Cracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination 

 - 119-126 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Wafer<br/>Adhesive<br/>Package Modeling