Kwon, Woon-Seong Jang, Se-Young Paik, Kyung-Wook <br/><br/>
Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process 

 - 172-174 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Exotherm<br/>Flip Chip<br/>Solder Bali Reliability