Hutt, David A. liu, Changqing Mannan, Samjid H. <br/><br/>
Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation 

 - 87-97 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electroless Nickel Plating<br/>Flip-Chip<br/>Bump Characterization