Wong, C. P. Wong, Michelie M. <br/><br/>
Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics 

 - 21-26 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Encapsulant<br/>Epoxidation<br/>Flip-Chip