TY  - SER
AU  - Chen, Chun-Jen
AU  - lin, Kwang-Lung
TI  - Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps
KW  - Diffusion Barriers
KW  - Electroless Nickel Plating
KW  - Flip-Chip
ER  -