Chen, Chun-Jen lin, Kwang-Lung <br/><br/>
Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps 

 - 691-697 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Diffusion Barriers<br/>Electroless Nickel Plating<br/>Flip-Chip