Xiao, Guo-Wei Chan, Philip C. H. Cai, Jian <br/><br/>
Effect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump 

 - 682-690 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Copper<br/>Electroplating<br/>Flip-Chip