Fan, X-J. lim, T. B. <br/><br/>
Investigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading 

 - 84-91 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Cracking<br/>Delamination<br/>Finite - Element Analysis