TY  - SER
AU  - Mcnaliy, Patrick J.
AU  - Danilewsky, A. N.
AU  - Curledy, John W.
TI  - Mapping of Mechanical, Thermomechanical and Wire-Bond Strain Fields in Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray Topography
KW  - High Resolution
KW  - Nondestructive Evaluation
KW  - Package Modeling
ER  -