Mcnaliy, Patrick J. Danilewsky, A. N. Curledy, John W. <br/><br/>
Mapping of Mechanical, Thermomechanical and Wire-Bond Strain Fields in Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray Topography 

 - 76-83 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>High Resolution<br/>Nondestructive Evaluation<br/>Package Modeling