TY  - SER
AU  - Zhang, Z
AU  - Shi, S. H.
AU  - Wong, C. P.
TI  - Development of No-Flow Underfili Materials  for  Lead-Free Solder Bumped Flip-Chip Applications
KW  - Epoxy Resin
KW  - Flip Chip
KW  - Lead-Free Solder
ER  -