Zhang, Z Shi, S. H. Wong, C. P. <br/><br/>
Development of No-Flow Underfili Materials  for  Lead-Free Solder Bumped Flip-Chip Applications 

 - 59-66 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Epoxy Resin<br/>Flip Chip<br/>Lead-Free Solder