li, X. P. Cai, M. B. Neo, W. C. L. Seah, K. H. <br/><br/>
Effect of Crystalilne Orientation of a Diamond Tool onMachined Surface in Ductile Mode Cutting of Silicon 

 - 1597-1604 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Nanoscale Ductile Cutting<br/>Silicon<br/>Diamond Cut