TY  - BOOK
AU  - Hsu, Tai-Ran
TI  - Mems Packaging 
SN  - 0863413358
U1  - 621.381 
PY  - 2004///
CY  - London : 
PB  - Inspec/The Institution of Electrical Engineers, 
KW  - Microelectromechanical Systems
KW  - Microelectronic Packaging
N1  - YY
UR  - https://eaklibrary.neduet.edu.pk:8443/catalog/bk/books/toc/0-86341-335-8.pdf
ER  -